Hong Kong to Reopen 10-Year Institutional Bond for Bidding on October 21
The Hong Kong Monetary Authority, acting for the SAR government, will reopen a 10-year institutional bond under the Infrastructure Bond Programme. Additional HKD 1.25 billion of the bond will be offered for tender on October 21, with settlement on October 22.
The Hong Kong Monetary Authority (HKMA), acting as representative of the Hong Kong Special Administrative Region (SAR) government, announced on October 14 that it will reopen the 10-year HKD institutional bond (issue number 10GB3507001) issued under the Infrastructure Bond Programme for tender.
The reopened bond will be offered for bidding on Wednesday, October 21, 2026, with settlement on Thursday, October 22, 2026. An additional HKD 1.25 billion of the outstanding 10-year bond will be available for tender.
The bond matures on July 24, 2035, and carries an annual interest rate of 3.17 per cent, payable semi-annually. As of October 14, 2026, the indicative price was 94.28, corresponding to an annualised yield of 3.986 per cent.
Tenders are restricted to primary dealers appointed under the Infrastructure Bond Programme. All bids must be submitted through primary dealers listed on the latest published list, available for download from the Hong Kong Government Bond website at www.hkgb.gov.hk. Each bid must be in multiples of HKD 50,000.
Tender results are expected to be announced no later than 3:00 pm on the tender day, and will be published on the HKMA website, the Hong Kong Government Bond website, Bloomberg (GBHK <GO>) and Refinitiv (IBPGSBPINDEX).