Alibaba chip unit T-Head plans up to US$3bn Hong Kong IPO in 2027
Alibaba's chip design subsidiary T-Head is planning a Hong Kong IPO in 2027, aiming to raise US$2 billion to US$3 billion, according to a report. Founded in 2018, T-Head has developed AI-centric data center chips and recently unveiled its next-generation Zhenwu V900 chip.
Alibaba's chip design unit T-Head is planning a Hong Kong initial public offering in 2027, aiming to raise between US$2 billion (HK$15.6 billion) and US$3 billion, according to a report by International Financing Review (IFR) citing unnamed sources.
Founded in 2018, T-Head is the chip design subsidiary of Chinese tech company Alibaba. According to its website, the unit has established a research and development system and end-to-end chip development capabilities.
In the data centre sector, T-Head has built a comprehensive suite of AI-centric data centre chip solutions covering parallel and general-purpose computing, high-speed interconnects and data storage, the website said.
In September, T-Head unveiled its next-generation AI chip, the Zhenwu V900, which Alibaba claimed was the most powerful AI chip in China in terms of computing performance. The chip can deliver three times the performance of its predecessor, the M890, and can be scaled into clusters of up to 500,000 chips for frontier model training.
Alibaba expects the Zhenwu V900 to enter mass production and hit the market in the first quarter of 2027.